This Week
  • CEO David Boyce has Tompkins Insurance Agencies on a growth path.

  • ROC the Future gives update on milestones for local education system.

  • The Greater Rochester Awards honorees are profiled.

  • Aware of challenges, private schools work to build a sustainable future.

  • Mech Tech HVAC CEO Edward Burns expects the firm to log solid growth in 2014.

  • Owner of U.S. Ceiling Corp. uses digital estimation to save time and stay competitive.

Xerox to move some operations from China to Canandaigua

Rochester Business Journal
December 19, 2013

The state on Thursday announced a partnership between Xerox Corp. and the SUNY College of Nanoscale Science and Engineering’s Smart System Technology & Commercialization Center to relocate high-tech manufacturing operations from China to the center in Canandaigua.

The state is investing $750,000 to support the partnership, which will create and retain up to 100 high-tech jobs over the next five years, officials said.

“As a global company, we manufacture around the world and have made the decision to bring this optics assembly project to New York where we can invest locally for key scanning technology requirements,” said Lee Nunziato, Xerox technology procurement manager, in a statement. “By participating in this public-private sector partnership, we are developing competitive solutions for the marketplace.”

Center officials said the collaboration marks another significant step forward in the growth of Canandaigua facility.

Through the partnership, Xerox has committed to relocate capital equipment used in the manufacture of advanced document scanning technologies from China to a 3,300-square-foot cleanroom to the facility in Canandaigua, state officials said. Additionally, Xerox is negotiating a five-year contract agreement with facility officials to purchase optical scanners once the production line is successfully transferred to the site.

The Canandaigua facility is home to advanced micro electromechanical systems fabrication and packaging capabilities for use in sensor-based, system-on-a-chip and computer chip applications.

(c) 2013 Rochester Business Journal. To obtain permission to reprint this article, call 585-546-8303 or email service@rbj.net.


What You're Saying 

There are no comments yet. Be the first to add yours!

Post Your Own Comment

 
Username:
Password:

Not registered? Sign up now!
 

To Do   Text Size
Post CommentPost A Comment eMail Size1
View CommentsView All Comments PrintPrint Size2
ReprintsReprints Size3
  • E-mailed
  • Commented
  • Viewed
RBJ   Google